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>> E2EZ-X4D1-M1J 0.3M OMRON Chip-immune Inductive Proximity Sensor
E2EZ-X4D1-M1J 0.3M OMRON Chip-immune Inductive Proximity Sensor
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Brand:
OMRON
Name: Chip-immune Inductive Proximity Sensor
Model: E2EZ-X4D1-M1J 0.3M
Appearance: Shielded, M18.
Sensing distance: 4 mm.
Output configuration: DC 2-wire, (3)-(4) pin arrangement.
Model: Operation mode, NO.
Chip-immune Inductive.
Proximity Sensor.
Correct operation even with aluminum or iron chips sticking,
to the Sensor.
Only the sensing object is detected.
Pre-wired Smartclick Connector Models also available.
...More relevant models >>>>
Name: Chip-immune Inductive Proximity Sensor
Model: E2EZ-X4D1-M1J 0.3M
Appearance: Shielded, M18.
Sensing distance: 4 mm.
Output configuration: DC 2-wire, (3)-(4) pin arrangement.
Model: Operation mode, NO.
Chip-immune Inductive.
Proximity Sensor.
Correct operation even with aluminum or iron chips sticking,
to the Sensor.
Only the sensing object is detected.
Pre-wired Smartclick Connector Models also available.
Sensing method: Diffuse-reflective Sensors.
Appearance: Vertical.
Connection method: Connector (M12).
Sensing distance: 200 mm .
Functions: --.
Model: NPN output.
Ordering Information.
Built-in Amplifier Photoelectric Sensors. Size: M18, Non-shielded.
Sensing distance: 16.0 mm.
Connection: M12 connector E2EZ-X4D1-M1J 0.3M OMRON.
Body material: Brass.
Thread length (overall length): 61 (75) E2EZ-X4D1-M1J 0.3M
Output configuration: PNP.
Operation mode NC.
Safe Mounting with Greater.
Sensing Distance.
Ensures a sensing distance approximately 1.5 to 2,
times larger than that of any conventional OMRON Sensor.
Problems such as the collision of workpieces are eliminated.
Full range of standard sizes (M8, M12, M18 and,
M30; both long and short barrels) E2EZ-X4D1-M1J 0.3M OMRON.
Modular construction simplifies customization. Sensing method: Diffuse-reflective.
Connection method: Pre-wired (2 m).
Sensing distance: 5 to 100 mm (wide view).
Model: NPN output .
The Standard for Photoelectric Sensors,
with a Secure Track Record of One,
Million Sold Yearly.
Long sensing distance of 30 m for Through-beam Models, 4 m for,
Retro-reflective Models, and 1 m for Diffuse-reflective Models E2EZ-X4D1-M1J 0.3M OMRON.
Mechanical axis and optical axis offset of less than ±2.5° simplifies,
optical axis adjustment.
High stability with unique algorithm that prevents interference of,
external light. Sensing method: Retro reflective.
Appearance: Horizontal.
Connection method: Standard M12 Connector.
Sensing distance: 1m [100 mm].
Model: PNP output.
Recommended application: Flat object,
Detecting glass wafers and LCD glass circuit boards, Ideal;
Cylindrical object,
Detecting plasticc bottles and other transparent containers, -- E2EZ-X4D1-M1J 0.3M.
Ideal for Detecting Glass Wafers,
and Other Transparent Objects,
Detects glass wafers and LCD glass circuit boards. Optical system: Diffuse reflective.
Beam shape: Line beam.
Seensing distance: 50±10mm E2EZ-X4D1-M1J 0.3M.
Resolution: 1.5µm.
Stable, Easy & Affordable.
New Regular-reflective Sensor Head.
Designed for Optimal Wafer Measurement.
Appearance: Vertical.
Connection method: Connector (M12).
Sensing distance: 200 mm .
Functions: --.
Model: NPN output.
Ordering Information.
Built-in Amplifier Photoelectric Sensors. Size: M18, Non-shielded.
Sensing distance: 16.0 mm.
Connection: M12 connector E2EZ-X4D1-M1J 0.3M OMRON.
Body material: Brass.
Thread length (overall length): 61 (75) E2EZ-X4D1-M1J 0.3M
Output configuration: PNP.
Operation mode NC.
Safe Mounting with Greater.
Sensing Distance.
Ensures a sensing distance approximately 1.5 to 2,
times larger than that of any conventional OMRON Sensor.
Problems such as the collision of workpieces are eliminated.
Full range of standard sizes (M8, M12, M18 and,
M30; both long and short barrels) E2EZ-X4D1-M1J 0.3M OMRON.
Modular construction simplifies customization. Sensing method: Diffuse-reflective.
Connection method: Pre-wired (2 m).
Sensing distance: 5 to 100 mm (wide view).
Model: NPN output .
The Standard for Photoelectric Sensors,
with a Secure Track Record of One,
Million Sold Yearly.
Long sensing distance of 30 m for Through-beam Models, 4 m for,
Retro-reflective Models, and 1 m for Diffuse-reflective Models E2EZ-X4D1-M1J 0.3M OMRON.
Mechanical axis and optical axis offset of less than ±2.5° simplifies,
optical axis adjustment.
High stability with unique algorithm that prevents interference of,
external light. Sensing method: Retro reflective.
Appearance: Horizontal.
Connection method: Standard M12 Connector.
Sensing distance: 1m [100 mm].
Model: PNP output.
Recommended application: Flat object,
Detecting glass wafers and LCD glass circuit boards, Ideal;
Cylindrical object,
Detecting plasticc bottles and other transparent containers, -- E2EZ-X4D1-M1J 0.3M.
Ideal for Detecting Glass Wafers,
and Other Transparent Objects,
Detects glass wafers and LCD glass circuit boards. Optical system: Diffuse reflective.
Beam shape: Line beam.
Seensing distance: 50±10mm E2EZ-X4D1-M1J 0.3M.
Resolution: 1.5µm.
Stable, Easy & Affordable.
New Regular-reflective Sensor Head.
Designed for Optimal Wafer Measurement.
...More relevant models >>>>
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